Thursday, 16th March 2017
09:00 - 09:30	Registration
09:30 - 09:40	Welcome [More Info] Roger Chang, President, Applied Materials China
09:40 - 10:00	Keynote: Semiconductor Portfolio: Introduction [More Info] Erix Yu, Group Vice President & President - Applied Materials Taiwan
10:00 - 10:45	Wafer-Level Packaging The Essential Technology in Enabling the China High Growth Semiconductor Industry [More Info] Albert Lan, SPIL
10:45 - 11:00	Break
11:00 - 11:25	Developing Advanced Packaging Equipment Leveraging Applied Packaging Development Center [More Info] Arvind Sundarrajan, Applied Materials
11:25 - 11:50	Metallization Solutions for Advanced Wafer-Level Packaging [More Info] Sree Kesapragada, Applied Materials
11:50 - 12:15	ECD Challenges for Advanced Wafer-Level Packaging [More Info] Marvin Bernt, Applied Materials
12:15 - 13:15	Lunch
13:15 - 13:45	14nm Technology Development Challenges & Status in SMIC [More Info] Beichao Zhang, SMIC
13:45 - 14:10	Gain a Competitive Edge with Inspection and Review [More Info] Bents Kidron, Applied Materials
14:10 - 14:35	Reflexion LK Prime for BEOL Applications [More Info] Fiona Heung, Applied Materials
14:35 - 15:00	Centris Sym3: Symmetric Etch Reactor for Delivering Tunable Local and Cross Wafer Uniformity [More Info] Jeff Tzong, Applied Materials
15:00 - 15:15	Break
15:15 - 15:40	VIISta Trident High Current Advanced Ion Implantation Solution for 28nm Technology Node [More Info] Qing Zhai, Applied Materials
15:40 - 16:05	Precision CVD: Next Generation CVD Chamber [More Info] Zhijun Jiang, Applied Materials
16:05 - 16:30	Data Analytics to Improve Process Tool Performance [More Info] Daniel Chou, Applied Materials
16:30 - 17:30	Closing Reception