INFLECTION FOCUSED INNOVATION
Please join us for a day-long program exploring the technical advances driven by continued scaling, 3D device architectures, and the development of diverse packaging schemes.
Presentations will offer an overview of Applied’s product
portfolio and highlight a wide range of technologies, including wafer-level
packaging solutions, recent developments in unit processes relevant to
memory and logic, and next-generation defect inspection technology.
PROGRAM DETAILS
Jumeirah Himalayas Hotel Shanghai
Himalayas Ballroom, 6th Floor
1108 Meihua Road
Pudong, Shanghai
卓美亚喜玛拉雅酒店
蝶宴会厅, 6F
浦东梅花路1108号
上海 201204, 中国
Thursday, March 16, 2017
09:00 – 09:30 Registration
09:30 – 12:00 Morning Session
12:00 – 13:00 Lunch
13:00 – 16:15 Afternoon Session
16:15 – 17:15 Reception
Please register online by 17:00 on March 15, 2017. After this time, you may register at the event site.
Please bring a copy of your business card to facilitate the check-in process as well as for the Lucky Draw.
Click here for directions from Shanghai New International Expo Center/SEMICON China.
