INNOVATION LEADERSHIP FOR ADVANCED PACKAGING

Please join us for a lunch reception followed by a half-day program exploring various innovative and cost effective advanced wafer level packaging solutions to enable better and more effective multi die system integration

REGISTER NOW: Click on the New Registration button to the right.

Who should attend: Personnel from Fabless companies and IDMs, turn-key supply chain management and OSATs

Presentations from Applied Materials and our invited guest speakers will provide an overview of the advanced packaging market and technology roadmap. The session will also include deep dives into various cost and technical challenges across different packaging schemes and showcase how Applied’s integrated solutions for 2.5D/3D & FOWLP are helping to drive on-wafer performance for improved device performance and yield.

MAY 22, 2018 

12:00 - 13:00   Registration & Lunch Reception
13:00 - 17:00   Technical Symposium

For enquiries, please contact AMSEA_Marketing@amat.com 

Please register online by 17:00 on May 18, 2018.

Please bring a copy of your business card to facilitate the check-in process.