MIG Conference – Japan
 

Sponsors

Interested in sponsoring MIG Congress Japan? Contact Karen Lightman today about opportunities or call (412) 390-1644.

Platinum Sponsor

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

For more information, visit: www.EVGroup.com



Gold Sponsors


Freescale is a global leader in embedded processing solutions, providing industry leading products that are advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – our technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Expanding on its more than 30-year heritage of sensor innovation, Freescale has an extensive portfolio of acceleration, magnetic, pressure, touch sensors and gyroscopes. Freescale's Xtrinsic sensing solutions are designed with the right combination of high-performance sensing capability, processing capacity and customizable software to help deliver smart, differentiated sensing applications.

Some of our key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. 

For more information visit: www.freescale.com/Sensors



SPP Technologies Co., Ltd.(SPT) was established in October 2011 as a joint venture of Sumitomo Precision Products Co., Ltd.(SPP) and SPTS Technologies Ltd.(SPTS), UK for Japanese market. SPT is a leading supplier of deep silicon etch for micro-electromechanical systems (MEMS).SPT pioneers development and commercialization of the deep reactive ion etching (DRIE) technology based on Robert Bosch patented switching process since 1994. SPT designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for not only MEMS but also the semiconductor industry and related markets. End-market applications include MEMS, advanced packaging, LED, high speed RF device IC’s and power semiconductors.

The solutions offered by SPT include market-leading silicon etch (Product name: Predeus, Pegasus, Pegasus300), SiC etch (APS), dielectric etch (APS), dry-release etch (SLE-Ox, Monarch25, Primaxx-uEtch, XACTIX-Xetch), PVD (Sigma), PECVD (Delta), APCVD and large batch vertical furnaces (AVP, RVP, RVP300plus). SPT supplies most of unit process systems for various MEMS devices and the integrated solutions.

For more information, visit: www.spp-technologies.co.jp/



Silver Sponsors

Headquartered in Kyoto, Japan, OMRON Corporation is a global leader in the field of automation. Established in 1933. OMRON has more than 36,000 employees in over 35 countries working to provide products and services to customers in a variety of fields including industrial automation, electronic components, MEMS, semiconductors, social systems, and healthcare. The company has five regional head offices in Kyoto (Japan), Singapore (Asia Pacific), Shanghai (Greater China), Amsterdam (Europe, Africa, and the Middle East), and Chicago (the Americas).

For more information visit: http://www.omron.com/


Teledyne DALSA Semiconductor is a leading pure-play MEMS Foundry with extensive experience on fabrication and materials science that make manufacturing of MEMS product possible on 150mm /200mm wafers. Teledyne DALSA Semiconductor also offers industry-leading manufacturing capability, design support and custom design services for high voltage CMOS ICs and MEMS micro-mirrors applications.

For more information, visit: www.teledynedalsa.com


Lunch Sponsor

Okmetic supplies advanced silicon wafers for sensor and semiconductor applications and sells its technological expertise. Okmetic is the global market leader in demanding MEMS-based sensor wafers, with 30 years’ experience in MEMS business. The company provides a wide range of 100-200mm silicon wafers for surface and bulk micromachining, encapsulation and MEMS-IC-integration designs including double-side polished (DSP), single-side polished (SSP), epitaxial, and bonded silicon-on-insulator (SOI) wafers.

Okmetic’s products are based on high-tech expertise generating added value for customers, innovative product development and an extremely efficient production process. Okmetic is ISO 9001, ISO 14001, and ISO/TS 16949 certified.


For more information, visit: www.okmetic.com



Cocktail Party Sponsor


Oxford Instruments offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable etching, deposition and growth of micro- and nano-structures.

 

Our systems provide process solutions for the micro- and nanometre engineering of materials for MEMS, semiconductor, optoelectronics, HBLED, PV, & microfluidics, high quality optical coating and many other applications in micro- and nanotechnology.

 

These solutions are based on core technologies in:

- Plasma Etch & Deposition

- Atomic Layer Deposition (ALD)

- Ion Beam Etch & Deposition

- Deep Silicon Etch Systems

 

Products range from compact stand-alone systems for R&D, through to batch tools and up to cassette-to-cassette and clustered platforms for production processing.


For more information, visit: http://www.oxford-instruments.com



SunEdison, formerly MEMC Electronic Materials, is a global leader in silicon wafer manufacturing. The company has been a pioneer in the design and development of silicon wafer technologies for more than 50 years. With manufacturing, service and support around the world, SunEdison enables the next generation of high performance semiconductor devices across all market segments, including MEMS. SunEdison's common stock is listed on the New York Stock Exchange under the symbol “SUNE.”

For more information, visit: www.sunedisonsilicon.com


X-FAB MEMS Foundry offers unsurpassed experience, expertise and execution with its high-volume MEMS manufacturing service. The first pure-play MEMS foundry, X-FAB draws on more than 15 years MEMS manufacturing. Operating from five fabs for MEMS and CMOS processes and an ecosystem of manufacturing and design partners, X-FAB is the proven choice for process development and installation, process capability, design support and long-term manufacturing stability. As well as customer specific process installation, X-FAB offers a range of qualified, open-platform processes and designs for key MEMS device types, enabling customers to have the fastest time to market in the foundry industry.

For more information, visit: www.xfab.com



Break Sponsor


Fries Research & Technology GmbH (FRT) offers a comprehensive range of metrological surface measuring systems for the non-destructive investigation of topography, profile, film thickness, roughness, abrasion and many other properties. More than 400 reputable international companies from the automotive, semiconductor, MEMS, optical, photovoltaic and many other industries equip their R&D and production departments with FRT metrology systems.

FRT operates from Bergisch Gladbach, Germany and maintains subsidiaries in China, Switzerland and the United States. Additionally, FRT provides a distribution and service network in the USA, Asia and Europe.

For more information, visit: www.frt-gmbh.de






Supporting Sponsors


Berkeley Sensor & Actuator Center is the National Science Foundation Industry/University Cooperative Research Center for MEMS and NEMS. BSAC was founded in 1986 to conduct commercially relevant interdisciplinary engineering research on micro and nano-scale sensors, moving mechanical elements, microfluidics, materials, processes, and systems. Our membership based organization of 150+ graduate student and postdoctoral researchers inspired by two dozen faculty from 8 departments and 3 campuses of the University of California, report regularly on over 100 projects, on a prepublication basis, to our 30+ member companies. BSAC welcomes inquiries from technology-leveraged companies and top students seeking advanced degrees in our specialties.

For more information, visit: http://bsac.eecs.berkeley.edu/



The Fraunhofer Institute for Electronic Nano Systems ENAS focuses on research and development in the field of smart systems integration. We accompany your project from specification and design to technology development and to product prototyping. The research and service portfolio of Fraunhofer ENAS covers:

  • High-precision sensors 
  • silicon-based and polymer-based MEMS/NEMS
  • Sensor and actuator systems with control units and evaluation electronics
  • Printed functionalities like antennas and batteries
  • Wafer level packaging of MEMS/NEMS,
  • System Integration, 3D integration 
  • Reliability of systems and components
Application areas are semiconductor industry, medical engineering, mechanical engineering, automotive industry, logistics as well as aeronautics.

For more information, visit: www.enas.fraunhofer.de/en



Micromachine Center (MMC) is a foundation dedicated to support establishment of technological basis of future MEMS/ Micromachine, as well as to support development of MEMS / Micromachine industries in Japan.

In cooperation with Japanese government, academy and industry, MMC leads activities to accelerate industrialization such as national R&D projects, various global & domestic networking, education & training, and Exhibition Micromachine/MEMS.

For more information, visit: www.mmc.or.jp/e/