GOMACTech 2019 Exhibition
 
Company Booth number/ref Company Description: 
3D Glass Solutions, Inc.7143DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics. 3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries.
Achronix Semiconductor Corporation308Achronix Semiconductor Corporation is a privately held, fabless semiconductor corporation based in Santa Clara, California and offers high-performance FPGA solutions. Achronix has received multiple awards for its products including the 2016 Arm TechCon “Best Silicon Product” award for Speedcore eFPGA IP and the 2017 UBM ACE Award for “Company of the Year”.
Advanced Radar Research Center at the University of Oklahoma305The Advanced Radar Research Center (ARRC, www.arrc.ou.edu) at the University of Oklahoma is the nation's largest academic radar program with over 120 faculty, students, post-docs, and professional staff. The ARRC specializes in end-to-end radar development: spanning radar components (including RF circuits, FPGAs, antenna design, etc.), signal processing, and data interpretation
Alphacore, Inc.410Alphacore Inc., founded in 2012, is located in the innovative Silicon Desert of Arizona’s technology center. Our engineering and management team combines long histories of delivering innovative RF, analog and mixed signal products and imaging systems for critical systems with business success at companies from multi-nationals to start-ups. Our design team includes seasoned “Radiation Hardened By Design” (RHBD) experts, and we specialize in designing high performance microelectronics, and reliability or authentication tools for niche needs of demanding segments, including scientific research, aerospace, defense, medical imaging, and homeland security.
ASIC North, Inc.417asicNorth provides comprehensive Very Large Scale Integration (VLSI) Development, Verification, Fabrication, Characterization, Qualification and Supply services to the semiconductor industry. We offer a wide range of innovative and well-managed solutions, technical and efficient skill sets, and flexible engagement models.
BAE Systems314
Battelle704Battelle’s Cyber Trust and Assurance business area focuses on providing the expertise, equipment, and advanced R&D to pioneer root of trust verification at the various electronic component levels to secure our nation’s critical mission systems and infrastructure. Visit us for a Barricade™ demonstration and to hear about Battelle’s trusted microelectronics expertise.
BRIDG309
Cadence Design Systems304
Checkpoint Technologies LLC406Checkpoint Technologies develops and manufactures innovative optical failure analysis tools used by semiconductor manufacturers to improve the speed and reliability of integrated circuits. Our products, which range from OEM components to fully-integrated, end-user solutions, reflect our fundamental commitment to maximizing value by adapting technology to meet specific market needs.
Cobham Semiconductor Solutions315Cobham Semiconductor Solutions offers LEON 3FT Microprocessors, Memories, Clocks, and Voltage Regulators. Cobham’s newest products, Arm Microcontroller and CrossPoint Switch, will be displayed. We offer ASICs, Circuit Card Assembly, Radiation Testing, and Trusted Services. Cobham Microelectronic Solutions designs and manufactures innovative custom RF/Microwave/Millimeter MMICs, modules, integrated assemblies, and sub-systems for demanding USG requirements. From amplifiers to switches, mixers, multipliers, T/R MMICs/modules, true time delay units, multi-function chips and array tiles. Cobham’s highly integrated system on a chip to single function MMICs are developed and used in demanding environments.
DMEA/TAPO412
EDAptive Computing, Inc.508Edaptive Computing, Inc (ECI) pioneers innovative solutions to optimize, assure, automate and integrate complex processes and systems. ECI is a Woman Owned Small Business headquartered in Dayton Ohio, with presence in National Capital Region.
ENGIN-IC Inc.506ENGIN-IC provides differentiation for companies looking for advanced MMIC and module solutions. ENGIN-IC utilizes many different semiconductor materials to create high performance microwave and mm-wave products.
Finetech311Finetech supplies sub-micron accuracy bonders for die attach, advanced packaging and micro assembly applications. Manual to fully-automated models provide process flexibility within one platform. Bonding technologies include thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium, vacuum die bonding and laser assisted bonding. Finetech also provides precision dispensers and advanced rework systems for today's challenging applications.
Flex Logix Technologies405eFPGA Semiconductor IP, Architecture & Software Supplier
Freedom Photonics507Freedom Photonics is a leading developer and manufacturer of opto-electronic components, such as high performance lasers, photodetectors, integrated optical transmitters, receivers and sensors. Freedom Photonics serves the communications, sensor and high power laser markets with a wide range of standard products and also designs products to customer requirements.
GE Global Research705
GLOBALFOUNDRIES605
Honeywell FMT411
HRL Laboratories, LLC.416HRL is recognized as a premier physical science and engineering-research organization, with groundbreaking advances in ultra-high-performance circuits; RF, photonic, and navigation systems; computational-network intelligence and autonomy-computing; and structures and materials. HRL’s ISO Level-4 cleanroom is AS9100 (ISO9001) and DoD Trusted-Foundry certified. HRL also offers commercial GaN MMIC products for sale.
Indiana Integrated Circuits, LLC516
Integra Technologies LLC415Integra Technologies LLC, a DMEA Trusted and an employee owned company with locations in Wichita, KS, Silicon Valley, CA, and Albuquerque, NM, is one of the largest semiconductor die prep, assembly, test & qualification facilities in the United States. Integra's operations have been satisfying customers for over 30 years by providing a wide variety of semiconductor services including: Die Prep, Assembly (plastic and ceramic), Test Development, Final Test, Characterization, Wafer Probe, Volume Production Test, Qualification Services (HTOL, HAST, Temp Cycle), DPA, CSAM, Failure Analysis, PEM Qualifications, Up-screening, Counterfeit Detection, Obsolescence Management, and Trusted Processing. Integra has one of the largest and most experienced test engineering organizations offering support for every device technology including FPGA, Microprocessor, ASIC, RF, Mixed Signal, Digital, Linear, Analog, SiP and MCMs. Integra provides 24x7 high or low volume US based manufacturing capacity and has demonstrated industry leading quality and on time delivery performance.
Intrinsix Corp.604Intrinsix offers IC design services for advanced electronics. The company leverages its experience with commercial semiconductor companies (complex processor-based digital AND mixed signal or RF designs at advanced nodes) into unique solutions for emerging DoD applications. The company has over 60 employees and is based in the U.S. – accredited, trusted, and focused since 1986.
JEOL USA, Inc510
JSTF307JSTF (a Merchant Foundry) providing storefront access to all Jazz Semiconductor Newport Beach technologies for mil/aero and intelligence communities. These technologies range from .5um CMOS to 130nm high-speed SiGe technologies and support applications ranging from ROICs to mmWave. 18021 Cowan, Suite J, Irvine, CA 92614 959-291-2649; www.jazztrusted.com
Menta eFPGA Inc.609Menta provides secured and trusted embedded FPGA IPs in any process node. ASIC like rad-hard eFPGA are available. Qualified on GF 32SOI & 14LPP & 22FDXcelerator member.
Metamagnetics, Inc.608Metamagnetics is a leading provider of high end RF components to enhance the performance and effectiveness of mission-critical security and communication systems. Our team offers unparalleled expertise in electromagnetism and materials science. With multiple product offerings, Metamagnetics can help you create innovative solutions for radar, sensing and related systems.
Micronet Solutions, Inc.513MicroNet Solutions, Inc. has over 25 years’ experience reverse engineering complex integrated circuits. MSI’s proprietary techniques extract functionality and microcode, and perform patent infringement, anti-tamper, and design verification services. The flagship Pix2Net software suite directly controls micro-positioning stages for accurate SEM capture, stitching, and alignment to completely analyze circuit connectivity.
Micross414
MIT Lincoln Laboratory204MIT Lincoln Laboratory researches and develops advanced technologies to meet critical national security needs. What sets us apart from many national R&D laboratories is an emphasis on building operational prototypes of the systems we design.
MOSIS616MOSIS provides access to fabrication of prototype and low-volume production quantities of integrated circuits. The company lowers the cost of fabrication by combining designs from many customers onto regularly scheduled multi-project wafer runs (MPWs), significantly decreasing the cost of each design. MOSIS also offers single-customer dedicated runs, which can be started at any time. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for different commercial firms, government agencies, and research and educational institutions. A variety of processes are available, including with ITAR and Trusted handling.
National Reconnaissance Office509An R & D Funding Program - The National Reconnaissance Office's Director's Innovation Initiative (DII) invests in advanced technologies, fosters innovation, and provides seed funding to push the boundaries of technology to dramatically improve our overhead reconnaissance capabilities. It presents an opportunity for developers not traditionally associated with the NRO to participate in building the National Reconnaissance Office of the 21st Century.
Nimbis Services Inc.606Nimbis Services, Inc., privately held, corporate office location in Oro Valley, AZ, and branches in IL, MD, NC, OH, OR, and WV. Nimbis offers e-commerce cloud product marketplace to connect buyers of technical computing services with providers, engineering applications, and support services.
ON Semiconductor408ON Semiconductor is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions from off-the-shelf components to custom devices. With on-shore design and manufacturing centers and Category 1A Trusted Broker, Design, Test and Foundry accreditation; ON Semiconductor provides military and defense applications with secure manufacturing environments and trusted solutions.
PacTech USA Inc.716PacTech-Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is head-quartered in Nauen, Germany with wholly owned subsidiaries: PacTech USA Packaging Technologies Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of two unique advanced packaging units: EQUIPMENT MANUFACTURING: PacLine 300 A50- Automatic ENIG & ENEPIG plating tools. SB2-Jet: Laser solder jetting equipment; Ultra-SB: Wafer-level solder ball transfer systems; LAPLACE: Laser assisted flip-chip bonders SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG, ENEPIG and Electroplating for UBM (solder bumping) or OPM (wirebond). Other services include AOI, X-Ray, Repassivation, RDL, Wafer Thinning, Backmetal, Dicing, and Tape and Reel.
Photronics, Inc.404Photronics is a leading worldwide manufacturer of Commercial, ITAR and Trusted Photomasks. Photomasks are high precision quartz plates that contain microscopic images of electronic circuits. A key element in the manufacture of semiconductors and flat panel displays, photomasks are used to transfer circuit patterns onto semiconductor wafers and flat panel display substrates during the fabrication of integrated circuits, a variety of flat panel displays and, to a lesser extent, other types of electrical and optical component.
Raith America, Inc.206Raith is a leading precision technology manufacturer for focused ion beam (FIB) nanofabrication, large area scanning electron microscopy (SEM), and electron beam lithography (EBL) instrumentation. With sub-10 nm patterning performance, Raith instruments are enabling researchers in academic and industry environments to continuously advance their applications in applied nanoscale research and development, as well as production of compound semiconductors components.
Sandia National Laboratories413
SILVACO617Silvaco, Inc. is a leading EDA provider of software tools used for process and device development and for analog/mixed-signal, power IC and memory design. Silvaco delivers a full TCAD-to-Signoff flow including tools for power integrity sign off, reduction of extracted netlist, variation analysis and also production-proven intellectual property (IP) cores.
SkyWater Technology Foundry511SkyWater is solely US-owned and a DMEA accredited pure-play semiconductor foundry specializing in development and manufacturing of differentiated integrated circuits and micro-technologies. World-class operational excellence and a heritage of innovation makes SkyWater the right size to develop new technologies, scale them to production and support long-term process availability.
Spectral Design & Test505
SRI International312The Defense Logistics Agency (DLA) sponsored Advanced Microcircuit Emulation (AME) Enrichment program develops, demonstrates, and provides a continuing source of advanced technology, high-reliability, military-quality microcircuits. The AME technology may be used to provide Form, Fit, and Function (FFF) solutions at the digital component level (e.g. logic devices, Application Specific-Integrated Circuits (ASICs), Field Programmable such as Gate Arrays (FPGAs), static memory devices, hybrids, microprocessors, and microcontrollers).
STRATEDGE CORPORATION205Manufacturer of High Performance Semiconductor Packages and Assembly Services
Synopsys515Synopsys delivers an integrated portfolio of FPGA design solutions to address challenges faced by designers including system verification, clock domain crossing, system quality of results and fast time-to-results. The portfolio for FPGA designers to find and fix bugs faster includes SpyGlass CDC and Lint, VCS simulation, Synplify synthesis, and hardware debug.
Teledyne Defense Electronics409Serving Defense, Space and Commercial sectors worldwide, Teledyne Defense Electronics offers a comprehensive portfolio of highly engineered solutions for your most demanding requirements in the harshest environments. Manufacturing both custom and off-the-shelf product offerings, our diverse product lines include semiconductors and contract manufacturing of advanced microelectronics. www.teledynedefelec.com
The Boeing Company504
Triad Semiconductor310Triad Semiconductor, Inc. (Triad) is a fabless semiconductor company specializing in analog and mixed signal integrated circuits. Triad’s integrated circuits offer higher levels of integration, higher performance, and lower power consumption when compared to traditional common-off-the-shelf (COTS) components. Furthermore, Triad has developed advanced fabrication technology allowing faster time to market and significantly lower development cost. This technology provides the ability to configure and interconnect on-chip analog and digital circuit blocks using only a single via-mask layer. Importantly, this via-configurable technology enables parametric analog and digital configurability (i.e., key circuit performance parameters can be modified on-chip with the single mask layer change.)
TSI SEMICONDUCTORS217TSI Semiconductors Corp. is a world-class semiconductor technology development and production volume CMOS foundry company who is the ideal partner for a wide range of IC projects. Located in close proximity to our customers’ design and engineering teams, we are driving innovation closer to the heart of Silicon Valley. We empower our customers’ device manufacturing by providing unprecedented on-site access to our fab floor and equipment. And, with our flexible technology development, customers accelerate learning cycles that get their products to market faster through greater control and protection of their technology and IP. At our 8-inch Roseville, California site, we provide an array of versatile process technologies that include analog/mixed-signal, deep-submicron, high-voltage BCDMOS, and solutions such as novel materials structures and devices. Specialized foundry services include automotive-grade, high-voltage BCDMOS, and technology capabilities utilizing novel materials, structures and devices.
Ultra Communications Inc.313Ultra Comm develops RF and photonic components for harsh environment and high reliability applications. These applications require components to operate through wide temperature ranges, shock, vibration, condensation, chemicals, and/or radiation. We specialize in challenging engineering tasks: high-speed mixed-signal circuit design, packaging for high fidelity electrical and optical coupling, and testing at the wafer and component level.
VORAGO Technologies512VORAGO Technologies is a privately held, fabless semiconductor company founded in 2004 and based in Austin, TX. VORAGO is a provider of radiation-hardened and extreme temperature-hardened IC components for the Hi-rel marketplace. VORAGO designs and develops high density SRAMs and MCUs using its patented HARDSIL® technology to simultaneously provide superior radiation and temperature endurance performance. VORAGO also provides custom ASIC design services. VORAGO's patented, innovative technology, HARDSIL®, has been proven in multiple CMOS process generations at multiple fabs to harden integrated circuits without redesign and is scalable to any generation node. Once modified by HARDSIL®, the commercial process flow can be used to manufacture significantly more robust CMOS circuits for highly reliable operation in extreme environments. This capability dramatically enhances the hardness and reliability of high density ICs and provides a disruptive alternative to current hi-rel approaches utilizing up-screened COTS, redundant systems, or exotic packaging.
Wolfspeed, A Cree Company611