The Society of Plastics Engineers’ Thermoplastic Materials & Foams Division (SPE TPM&F) is offering two student scholarships for undergraduate/graduate students in plastics/foams area.

The two $500 awards will be presented in FOAMS® 2016 conference (Sept. 14-15, 2016) in Seattle. The scholarships, named in memory of former TPM&F director Michael Reedy, are sponsored by Reedy International.

Criteria

1. Applicants for the scholarships must be full-time undergraduate or graduate students.
2. Applicants must have a demonstrated or expressed interest in the plastics/foams industry.
3. Applicants must be majoring in or taking courses that are beneficial to a career in the plastics/polymer industry.
4. Applicants must be in good academic standing with their schools (GPA > 3.0).
5. Applicants must be attending the FOAMS® 2016 conference. 

The application submitted must include:

1. 1-page statement telling why you are applying for the scholarship, your qualifications, and your educational and career goals in the plastics/foams industry.
   
2. One or two (2 preferred) recommendation letters from academic or professional individuals.
3. High school and/or college transcript for the past two years.
4. List of current and past school activities, community activities, and honors.